Product Description

Wafer dicing blade

Main cutting products: Silicon wafers, semiconductor compound wafers (GaAs, GaP, etc.), oxide wafers (LiTaO3, etc.), chip LED substrates, various semiconductor packaging components.

Electroplated nickel blade

Main cutting products: silicon wafers, semiconductor compound wafers (GaAs, GaP, etc.), various semiconductor packaging components, various semiconductor packaging components of other materials, unsintered ceramics, brittle and hard materials, other materials PZT, LiTaO3, ceramics, silicon wafers, Other materials composite materials (Si + glass, etc.), ceramics, other materials.

Payment Terms︰ T/T, L/C

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